Common Noise (continued)
... as much effort is expended to properly shield and ground the internal wires and cables of a component being treated. Upon a cursory review this may seem to be a relatively simple task, but in many cases that would be a naive assumption because much in the way of today's modern digital audio components and the noise they generate do not follow the common rules of proper grounding as they apply to components based on previous analog technology.
When noise is limited in frequency to around 100KHz, effective grounding methods are relatively simple and straightforward. Conversely, most all modern digital components and Class-D/switching amplifiers operate at frequencies far above that region and can produce noise artifacts well into the Megahertz range. At that point we are talking Radio Frequencies (RF), and any engineer will tell you that RF engineering is so complex it can almost be considered a "Black Art." That said, what was once a simple question of where to ground the shield of a given wire or cable and which end thereof now becomes nigh unto a mystery that requires specialized knowledge and training to determine. In lieu thereof, it is often better to just leave the component alone rather than attempt the process out of ignorance because simply grounding a given wire or cable at the wrong end can result in a noise condition that is worse than if the thing had been left alone.
Having previously worked for almost a decade in the development in SOTA high power (40KW) extreme high frequency (2MHz) switching amplifier technology in the engineering department of Crown International, we at TDSS are well versed in the processes and techniques required to perform the task properly and effectively. While there are certainly others that are able to do the same, few have a commensurate background in and passion for all things audio, while also offering an audio equipment upgrade service the likes of TDSS.
Generally speaking, the application of proper shielding and grounding techniques to the interconnecting wires and cables within a given component can make a substantial improvement in sonic performance... and even product reliability. As a result one would be tempted to expect that such methods would already be employed by the manufacturer of the component during its assembly at the factory, Nevertheless, due to cost constraints resulting from targeted price points for the product, etc. this is seldom the case - the main reason being that such techniques cannot easily be automated. Rather, the requisite manual labor is expensive and consequently avoided whenever possible. If reasonable product performance can be achieved without going to the effort, then it will not be done.
In adjunct to the above, proper circuit board layout and general circuit design often reduces the need for application of extensive shielding and grounding within a product, at least to the point that reasonably good performance can still be achieved without it - and to the manufacturer that is usually good enough. Then again, those methods alone never fully eliminate the underlying noise problems either. What few manufacturers realize is that "going the extra mile" to include it anyway can have a far more profound ability to further improve product performance than they would likely ever suspect. This is where the TDSS/s Dynamic Resolution Recovery Technology (D.R.R.T.) comes in... and where you can benefit from better sound than what you might ever have guessed as well.